Season 4 · Episode 109
This Year’s Model | Intel’s & Leti’s Trans-Atlantic Packaging | First Worm
November 6, 2020
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Show Notes
The Weekly Briefing podcast: It is almost impossible to create a modern product in a reasonable amount of time without models of hardware, or models of software, or – increasingly – models of both before anything is actually built or coded. How that works in practice is one of the marvels of modern engineering. A discussion with Altair SVP Pete Darnell. Also, Leti in France just began collaborating with Intel on advanced chip packaging. A discussion with EE Times newest contributor, Don Scansen.