Packaging innovation for space applications - with Texas Instruments
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Show Notes
Episode 62 of the Space Industry podcast is a discussion with Adrian Helwig, Analog Field Application Engineer, and Michael Seidl, Systems Engineer from Texas Instruments, about the packaging of electronic components for space.
In the episode we cover:
- The benefits of using plastic packages vs. ceramic packaging
- These include SWaP+C advantages, simpler production with no forming or trimming of lead frame required, and pin-compatibility between quality classes
- The role that Texas Instruments has played in supporting the standardization of QMLP
- How and why TI will continue to offer QMLV-RHA (ceramic) packaging
- How TI supports its space customers, with a catalog business approach, in order to enable rapid and predictable design execution, with strong supply capabilities
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