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Episode 3: Moore's Law and Process vs. Packaging
Episode 3

Episode 3: Moore's Law and Process vs. Packaging

Ben Bajarin and Jay Goldberg look at the challenges a slowing/dying Moore's Law has on foundries and silicon vendors. A key part of the discussion is the role process technology plays vs. packaging innovations in the future of the semiconductor industry.

The Circuit

January 16, 202340m 19s

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Show Notes

Ben Bajarin and Jay Goldberg look at the challenges a slowing/dying Moore's Law has on foundries and silicon vendors. A key part of the discussion is the role process technology plays vs. packaging innovations in the future of the semiconductor industry.

Topics

semiconductorstechnologyinnovationstartupsinvestingventure capital