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RM 117: When Residues Cause Circuit Assemblies to Fail
Episode 251

RM 117: When Residues Cause Circuit Assemblies to Fail

PCB Chat

April 12, 202329m 27s

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Show Notes

Eric Camden (lead investigator with Foresite) and Mike Konrad discuss electrochemical migration (ECM) and other failure modes caused by residues on circuit assemblies.