Season 2 · Episode 55
Advanced Packaging Innovations in the Semiconductor Industry with Chee Ping Lee of Lam Research
In The Arena by TechArena · Allyson Klein
August 12, 202419m 7s
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Show Notes
In this podcast, learn about the challenges of silicon advancement, the importance of advanced packaging, and how Lam is driving breakthroughs to support the future of AI and chiplet ecosystems.